Copper Wire Bonding Concerns and Best Practices
نویسندگان
چکیده
Copper wire bonding of microelectronic parts has developed as a means to cut the costs of using the more mature technology of gold wire bonding. However, with this new technology, changes in the bonding processes as well as bonding metallurgy can affect product reliability. This paper discusses the challenges associated with copper wire bonding and the solutions that the industry has been implementing. The paper also provides information to enable customers to conduct qualification and reliability tests on microelectronic packages to facilitate adoption in their target applications.
منابع مشابه
Wire bonding using copper wire
Purpose – This paper attempts to review recent advances in wire bonding using copper wire. Design/methodology/approach – Dozens of journal and conference articles published recently are reviewed. Findings – The problems/challenges such as wire open and short tail defects, poor bondability for stitch/wedge bonds, oxidation of Cu wire, strainhardening effects, and stiff wire on weak support struc...
متن کاملCopper Wire Bonding on Pure Palladium Surface Finishes – Eliminating the Gold Cost from the Electronic Package
During the past two years, fine pitch copper wire bonding has finally entered high volume production. It is estimated that nearly 15% of all wire bonders used in production are now equipped for copper wire bonding. Most of these are used exclusively for copper wire bonding. In terms of pitch, copper wire is only barely lagging behind the most advanced gold applications. The most commonly used c...
متن کاملOverview of wire bonding using copper wire or insulated wire
Wire bonding using copper or insulated wire leads to many advantages and new challenges. Research is intensively performed worldwide, leading to many new findings and solutions. This article reviews recent advances in wire bonding using copper wire or insulated wire for advanced microelectronics packaging. Journal articles, conference articles and patents published or issued recently are review...
متن کاملCHALLENGE IN FREE AIR BALLS FORMATION OF COPPER DURING THERMOSONIC WIRE BONDING PROCESS A. Jalar and S.H.A. Razak
Copper wire ball bonding has gained popularity recently due to its economic advantages and superior electrical and mechanical performances. Although it has great advantages compared to gold, however, it still not been widely used in industry because of some challenges that need to be addressed. One of the main challenges in this copper wire bonding process is to form a free air ball (FAB) witho...
متن کاملNext Generation Nickel-Based Bond Pads Enable Copper Wire Bonding
Copper wire bonding has huge cost advantages over gold wire bonding. As a result, low pin count, heavy wire applications have already been converted to copper wire and many companies are in high volume production. Recently, with the price of gold skyrocketing, conversion of high pin count (>250 I/O), high performance applications to Cu has dramatically accelerated. These high performance device...
متن کامل